CPU-Z 
  
Binaries 
CPU-Z version1.96.1.x64
  
Processors 
CPU Groups1
CPU Group 08 CPUs, mask=0xFF
  
Number of sockets1
Number of threads8
  
APICs 
Socket 0
     -- Core 0 (ID 0)
         -- Thread 00
         -- Thread 11
     -- Core 1 (ID 1)
         -- Thread 22
         -- Thread 33
     -- Core 2 (ID 2)
         -- Thread 44
         -- Thread 55
     -- Core 3 (ID 3)
         -- Thread 66
         -- Thread 77
  
Timers 
     ACPI timer3.580 MHz
     Perf timer10.000 MHz
     Sys timer1.000 KHz
  
  
Processors Information 
Socket 1ID = 0
     Number of cores4 (max 4)
     Number of threads8 (max 8)
     ManufacturerGenuineIntel
     NameIntel Core i7 3770
     CodenameIvy Bridge
     SpecificationIntel(R) Core(TM) i7-3770 CPU @ 3.40GHz
     Package (platform ID)Socket 1155 LGA (0x1)
     CPUID6.A.9
     Extended CPUID6.3A
     Core SteppingE1/L1
     Technology22 nm
     TDP Limit77.0 Watts
     Tjmax105.0 °C
     Core Speed1597.3 MHz
     Multiplier x Bus Speed16.0 x 99.8 MHz
     Base frequency (cores)99.8 MHz
     Base frequency (ext.)99.8 MHz
     Stock frequency3400 MHz
     Instructions setsMMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, EM64T, VT-x, AES, AVX
     Microcode Revision0x21
     L1 Data cache4 x 32 KB (8-way, 64-byte line)
     L1 Instruction cache4 x 32 KB (8-way, 64-byte line)
     L2 cache4 x 256 KB (8-way, 64-byte line)
     L3 cache8 MB (16-way, 64-byte line)
     Max CPUID level0000000Dh
     Max CPUID ext. level80000008h
     FID/VID Controlyes
  
  
     Turbo Modesupported, enabled
     Max non-turbo ratio34x
     Max turbo ratio39x
     Max efficiency ratio16x
     Min Power60 Watts
     O/C bins+4
     Ratio 1 core39x
     Ratio 2 cores39x
     Ratio 3 cores38x
     Ratio 4 cores37x
     TDP Level77.0 W @ 34x
  
     Temperature 031 degC (87 degF) (Package)
     Temperature 131 degC (87 degF) (Core #0)
     Temperature 228 degC (82 degF) (Core #1)
     Temperature 331 degC (87 degF) (Core #2)
     Temperature 430 degC (86 degF) (Core #3)
     Voltage 00.90 Volts (VID)
     Power 004.58 W (Package)
     Power 011.24 W (IA Cores)
     Power 02n.a. (GT)
     Power 033.33 W (Uncore)
     Clock Speed 01597.34 MHz (Core #0)
     Clock Speed 11597.34 MHz (Core #1)
     Clock Speed 21597.34 MHz (Core #2)
     Clock Speed 31597.34 MHz (Core #3)
     Core 0 max ratio39.0 (effective 37.0)
     Core 1 max ratio39.0 (effective 39.0)
     Core 2 max ratio39.0 (effective 37.0)
     Core 3 max ratio39.0 (effective 37.0)
  
  
  
Chipset 
NorthbridgeIntel Ivy Bridge rev. 09
SouthbridgeIntel Z75 rev. 04
Bus SpecificationPCI-Express 2.0 (5.0 GT/s)
Memory TypeDDR3
Memory Size32 GBytes
ChannelsDual
Memory Frequency798.7 MHz (1:6)
CAS# latency (CL)11.0
RAS# to CAS# delay (tRCD)11
RAS# Precharge (tRP)11
Cycle Time (tRAS)28
Command Rate (CR)2T
Host Bridge0x0150
  
Memory SPD 
DIMM #1
     SMBus address0x50
     Memory typeDDR3
     Module formatUDIMM
     Module Manufacturer(ID)Kingston (7F980000000000000000000000)
     Size8192 MBytes
     Max bandwidthPC3-14200 (889 MHz)
     Part numberKHX1866C10D3/8G
     Serial number0D256D28
     Manufacturing dateWeek 33/Year 16
     Number of banks8
     Nominal Voltage1.50 Volts
     EPPno
     XMPno
     AMPno
JEDEC timings tableCL-tRCD-tRP-tRAS-tRC @ frequency
     JEDEC #15.0-6-5-15-21 @ 465 MHz
     JEDEC #26.0-7-6-18-25 @ 558 MHz
     JEDEC #37.0-8-7-21-30 @ 651 MHz
     JEDEC #48.0-9-8-24-34 @ 744 MHz
     JEDEC #59.0-10-10-27-38 @ 837 MHz
     JEDEC #610.0-11-10-29-40 @ 888 MHz
     JEDEC #711.0-11-10-29-40 @ 888 MHz
     JEDEC #813.0-11-10-29-40 @ 888 MHz
  
DIMM #2
     SMBus address0x51
     Memory typeDDR3
     Module formatUDIMM
     Module Manufacturer(ID)Kingston (7F980000000000000000000000)
     Size8192 MBytes
     Max bandwidthPC3-14200 (889 MHz)
     Part numberKHX1866C10D3/8G
     Serial number212481E1
     Manufacturing dateWeek 33/Year 16
     Number of banks8
     Nominal Voltage1.50 Volts
     EPPno
     XMPno
     AMPno
JEDEC timings tableCL-tRCD-tRP-tRAS-tRC @ frequency
     JEDEC #15.0-6-5-15-21 @ 465 MHz
     JEDEC #26.0-7-6-18-25 @ 558 MHz
     JEDEC #37.0-8-7-21-30 @ 651 MHz
     JEDEC #48.0-9-8-24-34 @ 744 MHz
     JEDEC #59.0-10-10-27-38 @ 837 MHz
     JEDEC #610.0-11-10-29-40 @ 888 MHz
     JEDEC #711.0-11-10-29-40 @ 888 MHz
     JEDEC #813.0-11-10-29-40 @ 888 MHz
  
DIMM #3
     SMBus address0x52
     Memory typeDDR3L
     Module formatUDIMM
     Module Manufacturer(ID)Samsung (CE000000000000000000000000)
     Size8192 MBytes
     Max bandwidthPC3-12800 (800 MHz)
     Part numberM378B1G73EB0-YK0
     Serial number941F3762
     Manufacturing dateWeek 29/Year 15
     Number of banks8
     Nominal Voltage1.35 Volts
     EPPno
     XMPno
     AMPno
JEDEC timings tableCL-tRCD-tRP-tRAS-tRC @ frequency
     JEDEC #16.0-6-6-16-22 @ 457 MHz
     JEDEC #27.0-7-7-19-26 @ 533 MHz
     JEDEC #38.0-8-8-22-30 @ 609 MHz
     JEDEC #49.0-9-9-24-33 @ 685 MHz
     JEDEC #510.0-10-10-27-37 @ 761 MHz
     JEDEC #611.0-11-11-28-39 @ 800 MHz
  
DIMM #4
     SMBus address0x53
     Memory typeDDR3L
     Module formatUDIMM
     Module Manufacturer(ID)Samsung (CE000000000000000000000000)
     Size8192 MBytes
     Max bandwidthPC3-12800 (800 MHz)
     Part numberM378B1G73EB0-YK0
     Serial number941F37C9
     Manufacturing dateWeek 29/Year 15
     Number of banks8
     Nominal Voltage1.35 Volts
     EPPno
     XMPno
     AMPno
JEDEC timings tableCL-tRCD-tRP-tRAS-tRC @ frequency
     JEDEC #16.0-6-6-16-22 @ 457 MHz
     JEDEC #27.0-7-7-19-26 @ 533 MHz
     JEDEC #38.0-8-8-22-30 @ 609 MHz
     JEDEC #49.0-9-9-24-33 @ 685 MHz
     JEDEC #510.0-10-10-27-37 @ 761 MHz
     JEDEC #611.0-11-11-28-39 @ 800 MHz
  
  
Monitoring 
Mainboard Model2AD5 (0x000000EC - 0x000026E8)
  
LPCIO 
LPCIO VendorFintek
LPCIO ModelF71808A
LPCIO Vendor ID0x1934
LPCIO Chip ID0x1001
  
Hardware Monitors 
Hardware monitorFintek F71808
     Voltage 03.33 Volts [0xD0] (+3.3V)
     Voltage 11.03 Volts [0x81] (CPU VCORE)
     Voltage 22.08 Volts [0x82] (VIN2)
     Voltage 32.22 Volts [0xBD] (VIN3)
     Voltage 73.30 Volts [0xCE] (VSB3V)
     Voltage 83.42 Volts [0xD6] (VBAT)
     Temperature 027 degC (80 degF) [0x1B] (TMPIN0)
     Temperature 132 degC (89 degF) [0x20] (TMPIN1)
     Fan 0972 RPM [0x607] (FANIN0)
     Fan 1966 RPM [0x611] (FANIN1)
     Fan PWM 033 pc [0x54] (CPU)
     Fan PWM 123 pc [0x3A] (System Fan 1)
     Fan PWM 250 pc [0x7F] (System Fan 2)
     Fan PWM 3100 pc [0xFF] (System Fan 3)
  
  
PCI Devices 
DescriptionHost Bridge
Locationbus 0 (0x00), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x0150
     Revision ID0x09
  
DescriptionVGA Controller
Locationbus 0 (0x00), device 2 (0x02), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x0162
     Revision ID0x09
  
DescriptionUSB Controller (xHCI)
Locationbus 0 (0x00), device 20 (0x14), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x1E31
     Revision ID0x04
  
DescriptionCommunication Device
Locationbus 0 (0x00), device 22 (0x16), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x1E3A
     Revision ID0x04
  
DescriptionUSB 2.0 Controller (EHCI)
Locationbus 0 (0x00), device 26 (0x1A), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x1E2D
     Revision ID0x04
  
DescriptionHigh Definition Audio (HDA)
Locationbus 0 (0x00), device 27 (0x1B), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x1E20
     Revision ID0x04
  
DescriptionPCI to PCI Bridge
Locationbus 0 (0x00), device 28 (0x1C), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x1E10
     Revision ID0xC4
  
DescriptionPCI to PCI Bridge
Locationbus 0 (0x00), device 28 (0x1C), function 5 (0x05)
Common header
     Vendor ID0x8086
     Model ID0x1E1A
     Revision ID0xC4
  
DescriptionUSB 2.0 Controller (EHCI)
Locationbus 0 (0x00), device 29 (0x1D), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x1E26
     Revision ID0x04
  
DescriptionPCI to ISA Bridge
Locationbus 0 (0x00), device 31 (0x1F), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x1E46
     Revision ID0x04
  
DescriptionSerial ATA Controller - AHCI
Locationbus 0 (0x00), device 31 (0x1F), function 2 (0x02)
Common header
     Vendor ID0x8086
     Model ID0x1E02
     Revision ID0x04
  
DescriptionSMBus Controller
Locationbus 0 (0x00), device 31 (0x1F), function 3 (0x03)
Common header
     Vendor ID0x8086
     Model ID0x1E22
     Revision ID0x04
  
DescriptionEthernet Controller
Locationbus 2 (0x02), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x1969
     Model ID0x1091
     Revision ID0x08
  
  
DMI 
SMBIOS Version2.7
  
DMI BIOS
     vendorAMI
     version8.21
     date10/20/2014
     ROM size8192 KB
  
DMI System Information
     manufacturerHewlett-Packard
     productHP Elite 7500 Series MT
     version1.00
     serialCZC251254Y
     UUID{7EE2DCFE-BB5B-F5E4-9630-B078F70CE41B}
     SKUC5X90EA#BCM
     family103C_53307F G=D
  
DMI Baseboard
     vendorPEGATRON CORPORATION
     model2AD5
     revision1.03
     serial1234567890123456
  
DMI System Enclosure
     manufacturerHewlett-Packard
     chassis typeDesktop
     chassis serialunknown
  
DMI Extension Slot
     designationPCI Express x16 Slot
     typeA5
     populatedno
  
DMI Extension Slot
     designationPCI Express x1 Slot 1
     typeA5
     populatedno
  
DMI Extension Slot
     designationPCI Express x1 Slot 2
     typeA5
     populatedno
  
DMI Extension Slot
     designationPCI Express x1 Slot 3
     typeA5
     populatedno
  
DMI Extension Slot
     designationMini Card Slot 1
     typeA5
     populatedno
  
DMI OEM Strings
     string[0]FBYTE#2U2V3E3N3Q3R3X474C4k5W5c676J6S6b6y727C7J7M7Q7T7W7m8C8R9Sap
     string[1]aqaz.rQ;BUILDID#11WWPSEW601#SBCM#DBCM;
     string[2]
     string[3]
     string[4]
     string[5]
     string[6]
     string[7]
     string[8]
     string[9]
     string[10]
     string[11]
     string[12]
     string[13]
     string[14]
     string[15]
  
DMI Physical Memory Array
     locationMotherboard
     usageSystem Memory
     correctionNone
     max capacity32 GB
     max# of devices4
  
DMI Memory Device
     designationChannelA-DIMM0
     formatDIMM
     typeDDR3
     total width64 bits
     data width64 bits
     size8 GB
  
DMI Memory Device
     designationChannelA-DIMM1
     formatDIMM
     typeDDR3
     total width64 bits
     data width64 bits
     size8 GB
  
DMI Memory Device
     designationChannelB-DIMM0
     formatDIMM
     typeDDR3
     total width64 bits
     data width64 bits
     size8 GB
  
DMI Processor
     manufacturerIntel(R) Corporation
     modelIntel(R) Core(TM) i7-3770 CPU @ 3.40GHz
     clock speed3400.0 MHz
     FSB speed100.0 MHz
     multiplier34.0x
  
DMI Memory Device
     designationChannelB-DIMM1
     formatDIMM
     typeDDR3
     total width64 bits
     data width64 bits
     size8 GB
  
  
Graphics 
Number of adapters1
  
Graphic APIs 
APID3D
APIIntel I/O
  
Display Adapters 
Display adapter 0
     ID0x4000000
     NameMicrosoft Basic Display Adapter
     Board ManufacturerHewlett-Packard
     PCI devicebus 0 (0x0), device 2 (0x2), function 0 (0x0)
         Vendor ID0x8086 (0x103C)
         Model ID0x0162 (0x2AD5)
         Revision ID0x9
     Driver version10.0.19041.1
     WDDM Model1.3
  
Win32_VideoControllerAdapterRAM = 0x0 (0)
Win32_VideoControllerDriverVersion = 10.0.19041.868
Win32_VideoControllerDriverDate = 06/21/2006
  
Monitor 0
     ModelVW222 ()
     IDACI22A2
     Serial88LMQC001325
     Manufacturing DateWeek 33, Year 2008
     Size22.0 inches
     Max Resolution1680 x 1050 @ 59 Hz
     Horizontal Freq. Range31-81 kHz
     Vertical Freq. Range56-75 Hz
     Max Pixel Clock170 MHz
     Gamma Factor2.2
  
  
Software 
Windows VersionMicrosoft Windows 10 (10.0) Enterprise Edition 64-bit (Build 19041)
DirectX Version11.0