CPU-Z 
  
Binaries 
CPU-Z version1.93.0.x64
  
Processors 
Number of sockets1
Number of threads4
  
APICs 
Socket 0
     -- Core 0 (ID 0)
         -- Thread 00
         -- Thread 11
     -- Core 1 (ID 1)
         -- Thread 22
         -- Thread 33
  
Timers 
     ACPI timer3.580 MHz
     Perf timer10.000 MHz
     Sys timer1.000 KHz
  
  
Processors Information 
Socket 1ID = 0
     Number of cores2 (max 2)
     Number of threads4 (max 4)
     ManufacturerGenuineIntel
     NameIntel Core i3 3240
     CodenameIvy Bridge
     SpecificationIntel(R) Core(TM) i3-3240 CPU @ 3.40GHz
     Package (platform ID)Socket 1155 LGA (0x1)
     CPUID6.A.9
     Extended CPUID6.3A
     Core SteppingL1
     Technology22 nm
     TDP Limit55.0 Watts
     Tjmax105.0 °C
     Core Speed3391.9 MHz
     Multiplier x Bus Speed34.0 x 99.8 MHz
     Base frequency (cores)99.8 MHz
     Base frequency (ext.)99.8 MHz
     Stock frequency3400 MHz
     Instructions setsMMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, EM64T, VT-x, AVX
     Microcode Revision0x20
     L1 Data cache2 x 32 KBytes, 8-way set associative, 64-byte line size
     L1 Instruction cache2 x 32 KBytes, 8-way set associative, 64-byte line size
     L2 cache2 x 256 KBytes, 8-way set associative, 64-byte line size
     L3 cache3 MBytes, 12-way set associative, 64-byte line size
     Max CPUID level0000000Dh
     Max CPUID ext. level80000008h
     Cache descriptorLevel 1, D, 32 KB, 2 thread(s)
     Cache descriptorLevel 1, I, 32 KB, 2 thread(s)
     Cache descriptorLevel 2, U, 256 KB, 2 thread(s)
     Cache descriptorLevel 3, U, 3 MB, 16 thread(s)
     FID/VID Controlyes
  
  
     Turbo Modenot supported
     Max non-turbo ratio34x
     Max turbo ratio34x
     Max efficiency ratio16x
     Min Power44 Watts
     O/C binsnone
     Ratio 1 core34x
     Ratio 2 cores34x
     Ratio 3 cores34x
     Ratio 4 cores34x
     TDP Level55.0 W @ 34x
  
     Temperature 039 degC (102 degF) (Package)
     Temperature 136 degC (96 degF) (Core #0)
     Temperature 239 degC (102 degF) (Core #1)
     Voltage 01.03 Volts (VID)
     Power 0029.01 W (Package)
     Power 0111.79 W (IA Cores)
     Power 020.02 W (GT)
     Power 0317.20 W (Uncore)
     Clock Speed 03391.91 MHz (Core #0)
     Clock Speed 13391.91 MHz (Core #1)
     Core 0 max ratio34.0 (effective 34.0)
     Core 1 max ratio34.0 (effective 34.0)
  
  
  
Chipset 
NorthbridgeIntel Ivy Bridge rev. 09
SouthbridgeIntel H61 rev. B3
Memory TypeDDR3
Memory Size8 GBytes
ChannelsDual
Memory Frequency665.1 MHz (1:5)
CAS# latency (CL)9.0
RAS# to CAS# delay (tRCD)9
RAS# Precharge (tRP)9
Cycle Time (tRAS)24
Command Rate (CR)1T
Host Bridge0x0150
  
Memory SPD 
DIMM #1
     SMBus address0x50
     Memory typeDDR3
     Module formatUDIMM
     Module Manufacturer(ID)Kingston (7F98000000000000000000)
     Size4096 MBytes
     Max bandwidthPC3-10700 (667 MHz)
     Part number99U5584-007.A00LF
     Serial number161FBD43
     Manufacturing dateWeek 03/Year 18
     Number of banks8
     Nominal Voltage1.50 Volts
     EPPno
     XMPno
     AMPno
JEDEC timings tableCL-tRCD-tRP-tRAS-tRC @ frequency
     JEDEC #16.0-6-6-17-23 @ 457 MHz
     JEDEC #27.0-7-7-20-27 @ 533 MHz
     JEDEC #38.0-8-8-22-30 @ 609 MHz
     JEDEC #49.0-9-9-24-33 @ 666 MHz
  
DIMM #2
     SMBus address0x52
     Memory typeDDR3
     Module formatUDIMM
     Module Manufacturer(ID)Samsung (CE00000000000000000000)
     Size4096 MBytes
     Max bandwidthPC3-12800 (800 MHz)
     Part numberM378B5173DB0-CK0
     Serial number15F63587
     Manufacturing dateWeek 16/Year 14
     Number of banks8
     Nominal Voltage1.50 Volts
     EPPno
     XMPno
     AMPno
JEDEC timings tableCL-tRCD-tRP-tRAS-tRC @ frequency
     JEDEC #16.0-6-6-16-22 @ 457 MHz
     JEDEC #27.0-7-7-19-26 @ 533 MHz
     JEDEC #38.0-8-8-22-30 @ 609 MHz
     JEDEC #49.0-9-9-24-33 @ 685 MHz
     JEDEC #510.0-10-10-27-37 @ 761 MHz
     JEDEC #611.0-11-11-28-39 @ 800 MHz
  
  
Monitoring 
Mainboard Model2ABF (0x000000FB - 0x00002730)
  
LPCIO 
LPCIO VendorITE
LPCIO ModelIT8772
LPCIO Vendor ID0x90
LPCIO Chip ID0x8772
LPCIO Revision ID0x1
  
Hardware Monitors 
Hardware monitorITE IT8772
     Voltage 212.17 Volts [0xA9] (+12V)
     Voltage 35.04 Volts [0x8C] (+5V)
     Voltage 73.26 Volts [0x88] (+3.3V)
     Temperature 128 degC (82 degF) [0x1C] (TMPIN1)
     Temperature 239 degC (102 degF) [0x27] (TMPIN2)
     Fan 11017 RPM [0x298] (FANIN1)
     Fan 2840 RPM [0x324] (FANIN2)
     Fan PWM 00 pc [0x0] (FANPWM0)
     Fan PWM 10 pc [0x0] (FANPWM1)
     Fan PWM 20 pc [0x0] (FANPWM2)
  
Hardware monitorHardware monitor ID=0xFFFFFFFF
  
Hardware monitorD3D
  
Hardware monitorIntel I/O
     Temperature 040 degC (104 degF) [0x28] (GPU)
  
  
PCI Devices 
DescriptionHost Bridge
Locationbus 0 (0x00), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x0150
     Revision ID0x09
  
DescriptionPCI to PCI Bridge
Locationbus 0 (0x00), device 1 (0x01), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x0151
     Revision ID0x09
  
DescriptionVGA Controller
Locationbus 0 (0x00), device 2 (0x02), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x0152
     Revision ID0x09
  
DescriptionCommunication Device
Locationbus 0 (0x00), device 22 (0x16), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x1C3A
     Revision ID0x04
  
DescriptionUSB 2.0 Controller (EHCI)
Locationbus 0 (0x00), device 26 (0x1A), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x1C2D
     Revision ID0x05
  
DescriptionMultimedia device
Locationbus 0 (0x00), device 27 (0x1B), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x1C20
     Revision ID0x05
  
DescriptionPCI to PCI Bridge
Locationbus 0 (0x00), device 28 (0x1C), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x1C10
     Revision ID0xB5
  
DescriptionPCI to PCI Bridge
Locationbus 0 (0x00), device 28 (0x1C), function 5 (0x05)
Common header
     Vendor ID0x8086
     Model ID0x1C1A
     Revision ID0xB5
  
DescriptionUSB 2.0 Controller (EHCI)
Locationbus 0 (0x00), device 29 (0x1D), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x1C26
     Revision ID0x05
  
DescriptionPCI to ISA Bridge
Locationbus 0 (0x00), device 31 (0x1F), function 0 (0x00)
Common header
     Vendor ID0x8086
     Model ID0x1C5C
     Revision ID0x05
  
DescriptionSerial ATA Controller
Locationbus 0 (0x00), device 31 (0x1F), function 2 (0x02)
Common header
     Vendor ID0x8086
     Model ID0x1C02
     Revision ID0x05
  
DescriptionSMBus Controller
Locationbus 0 (0x00), device 31 (0x1F), function 3 (0x03)
Common header
     Vendor ID0x8086
     Model ID0x1C22
     Revision ID0x05
  
DescriptionEthernet Controller
Locationbus 3 (0x03), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x10EC
     Model ID0x8168
     Revision ID0x06
  
  
DMI 
SMBIOS Version2.7
  
DMI BIOS
     vendorAMI
     version8.17
     date10/25/2013
     ROM size8192 KB
  
DMI System Information
     manufacturerHewlett-Packard
     productHP Pro3500 Series
     versionunknown
     serialCZC4194S0C
     UUID{46ADBB81-65A4-BE6A-3485-9B2EB3B0659A}
     SKUD5R79EA#BCM
     family103C_53307F G=D
  
DMI Baseboard
     vendorFoxconn
     model2ABF
     revision3.20
     serialunknown
  
DMI System Enclosure
     manufacturerHewlett-Packard
     chassis typeDesktop
     chassis serialunknown
  
DMI Extension Slot
     designationPCI Express x16 Slot
     typeA5
     populatedno
  
DMI Extension Slot
     designationPCI Express x1 Slot #1
     typeA5
     populatedno
  
DMI Extension Slot
     designationPCI Express x1 Slot #2
     typeA5
     populatedno
  
DMI Extension Slot
     designationPCI Express x1 Slot #3
     typeA5
     populatedno
  
DMI Extension Slot
     designationMini Card Slot
     typeA5
     populatedno
  
DMI OEM Strings
     string[0]FBYTE#2U3E3N3Q3R3X474C4k5W5c676J6S6b6y727J7M7Q7T7W7m7z8C8S9Sapaq
     string[1]azbp.4h;BUILDID#11WWSNFW604#SBCM#DBCM;
     string[2]
     string[3]
     string[4]
     string[5]
     string[6]
     string[7]
     string[8]
     string[9]
     string[10]
     string[11]
     string[12]
     string[13]
     string[14]
     string[15]
  
DMI Processor
     manufacturerIntel(R) Corporation
     modelIntel(R) Core(TM) i3-3240 CPU @ 3.40GHz
     clock speed3400.0 MHz
     FSB speed100.0 MHz
     multiplier34.0x
  
DMI Physical Memory Array
     locationMotherboard
     usageSystem Memory
     correctionNone
     max capacity16 GB
     max# of devices2
  
DMI Memory Device
     designationDIMM1
     formatDIMM
     typeDDR3
     total width64 bits
     data width64 bits
     size4 GB
  
DMI Memory Device
     designationDIMM3
     formatDIMM
     typeDDR3
     total width64 bits
     data width64 bits
     size4 GB
  
  
Graphics 
Number of adapters1
  
Graphic APIs 
APID3D
APIIntel I/O
  
Display Adapters 
Display adapter 0
     ID0x4000000
     NameIntel(R) HD Graphics
     Board ManufacturerHewlett-Packard
     PCI devicebus 0 (0x0), device 2 (0x2), function 0 (0x0)
     Vendor ID0x8086 (0x103C)
     Model ID0x0152 (0x2ABF)
     Revision ID0x9
     Performance Level0
  
Win32_VideoControllerAdapterRAM = 0x84000000 (2214592512)
Win32_VideoControllerDriverVersion = 10.18.10.4252
Win32_VideoControllerDriverDate = 07/10/2015
  
Monitor 0
     ModelSyncMaster (Samsung)
     IDSAM027D
     SerialHSDP800135
     Manufacturing DateWeek 32, Year 2007
     Size20.0 inches
     Max Resolution1680 x 1050 @ 59 Hz
     Horizontal Freq. Range30-81 kHz
     Vertical Freq. Range56-75 Hz
     Max Pixel Clock140 MHz
     Gamma Factor2.2
  
  
Software 
Windows VersionMicrosoft Windows 10 (10.0) Home 64-bit (Build 17763)
DirectX Version12.0